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Heat Shrinkable Compound Double Wall Pipe

Heat shrinkable compound double wall pipe made of heat shrinkable insulation material and heat shrinkable semiconductive material by the way of special processing technology.Inner layer show good insulation performance,outer layer is of semi-conductive,inner and outer layers are clung closely,shielded reliably．

Inquiry


Characteristics
Heat shrinkable compound double wall pipe made of heat shrinkable insulation material and heat shrinkable semiconductive material by the way of special processing technology.Inner layer show good insulation performance,outer layer is of semi-conductive,inner and outer layers are clung closely,shielded reliably． 

Application
It is used for the insulation and outer shleld of medium joint in 35kV and below power cable,and others where it needs for the insulation and shleld .

Technical index(Inner insulation layer) 


Content

Measurement methods

Index

Hardness (Shore A )

 

≤90

Tensile strength(Mpa)

GB/T1040

≥12

Crack elongation (%)

GB/T1040

≥300

120℃x168h Heat aging

 

K1＞0.8, K2＞0.7

Volume resistivity(Ω.cm)

GB/T1040

≥1x1014

Water-absorbing rate (%)

ASTM D570

≤0.5



Technical index(Outer insulation layer) 


Content

Measurement methods

Index

Hardness (Shore A )

 

≤90

Tensile strength(Mpa)

GB/T1040

≥14

Crack elongation (%)

GB/T1040

≥300

120℃x168h Heat aging

 

K1＞0.8, K2＞0.7

Volume resistivity(Ω.cm)

GB/T1040

50～100



Specification 


Type and specification


Internal diameter 
before shrinking(mm)



Internal diameter 
after shrinking (mm)


Toal wall thickness

Length

HDFH 30/11

≥30

≤1

4.5

300～1200

HDFH 35/13

≥35

≤13

4.5

300～1200

HDFH 45/16

≥45

≤16

4.5

300～1200

HDFH 55/20

≥55

≤20

4.5

300～1200

HDFH 65/25

≥65

≤25

4.5

300～1200

HDFH 88/30

≥85

≤30

5

300～1200

HDFH 100/38

≥100

≤38

5

300～1200

HDFH 120/45

≥120

≤45

5

300～1200

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